Summary:A copper pillar assembly is a type of electrical interconnect technology used to connect components ...
A
copper pillar assembly is a type of electrical interconnect technology used to connect components on printed circuit boards (PCBs) or other electronic devices. It consists of a cylindrical copper pillar or post that is soldered to the surface of the PCB, with a conductive pad at each end to provide electrical connections.
The copper pillar assembly is used in place of other traditional interconnect methods, such as wire bonding or flip-chip bonding, in applications where high electrical and mechanical performance is required. Copper pillar assemblies provide high-density interconnects, which enable miniaturization and increased functionality of electronic devices. They are particularly useful in applications such as mobile phones, tablets, and other consumer electronic devices where space is limited.
Copper pillar assemblies are manufactured using a variety of techniques, including electroplating and chemical deposition. The assembly process typically involves soldering the copper pillar to the PCB using reflow soldering or other soldering techniques, followed by encapsulation with a protective coating or encapsulant to provide mechanical strength and protect against environmental factors. The exact design and configuration of the copper pillar assembly can vary depending on the specific application and requirements of the electronic device.
The main technical parameters:1, accuracy level: 2 ~ 4000A; 0.5: 5000 ~ 10000A; 1 level.2, the ambient conditions: -40 ~ +60 ℃, relative humidity ≤ 95% (35 ℃).3, overload performance: rated current 120%, 2 hours.4, the voltage drop: 50mV60mV70mV100mV5, the load under the heat: temperature stability tends to change, the rated current 50A the following does not exceed 80 ℃; rated current 50A or more does not exceed 120 ℃.
China Manganin Shunts Manufacturers
English